Name	Vacuum plasma processing system
Model	CRF-VPO-8L-M
Control system	PLC+screen
Power	380V/AC,50/60Hz, 3kw
IF power supply power	1000W/40KHz/13.56MHz
Capacity	30L(Option)
Number of layers	4(Option)
Effective processing area	200(L)*150(W)(Option)
Gas channel	Two working gas options: Ar, N2, CF4, O2

Scope of application

The vacuum plasma cleaning machine is suitable for printed circuit board industry, semiconductor IC field, silica gel, plastics, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high-frequency board surface activation, multilayer board surface cleaning, de-drilling dirt, soft board, soft-hard combined board surface cleaning, de-drilling dirt, activation before soft board reinforcement. Semiconductor IC field: COB, COG, COF, ACF process, used for cleaning before bonding and welding; silica gel, plastic, polymer field silica gel, plastic, polymer plasma surface roughening, etching, and activation.
Vacuum plasma cleaning machine system manufacturers use the plasma formed by gas ionization to perform surface treatment on the product workpiece, whether it is cleaning or surface activation, in order to better achieve high-quality treatment effects, different products need to choose different processing techniques Gas, the common processing gas of plasma cleaning machine is oxygen (Oxygen, O2), argon (Argon, Ar), nitrogen (Nitrogen, N2), compressed air (Compressed Air, CDA), carbon dioxide (Carbon, CO2), hydrogen (Hydrogen, H2), Carbontetrafluoride (CF4) and so on.
1. Oxygen
Oxygen is a common active gas for plasma cleaning. This is a physics + chemical treatment method. Ions caused by ionization after ionization can physically bombard the surface, resulting in a non-smooth and rough surface. In addition, the highly active oxygen ions can react with the broken molecular structure chain to transform into a hydrophilic surface with active groups to complete the surface activity; and the broken organic pollutants can interact with active oxygen. The ions produce chemical reactions, and molecules such as CO, CO2, and H2O are released from the surface to complete the surface cleaning. Oxygen is used for the surface activity of high-molecular polymers and the removal of contaminants, but it cannot be used for easily oxidized metal surfaces. Under vacuum plasma, the oxygen plasma is light blue, and part of it is milky white during charging and discharging; the light in the discharge environment is bright, and it is very likely that the actual discharge in the cavity cannot be seen when viewed with the naked eye.
2. Hydrogen
Similar to oxygen, hydrogen is a highly reactive gas that can activate and clean the surface. The key difference between hydrogen and oxygen depends on the different functional groups produced after the reaction. In addition, hydrogen is also reductive and can be used to remove the microscopic oxide layer of the metal surface, and it is not easy to destroy the more sensitive organic layer on the surface. Therefore, it is widely used in microelectronics technology, semiconductor materials and PCB circuit board processing and manufacturing. Because hydrogen is a dangerous gas, it is easy to fuse with oxygen and cause an explosion without ionization. Therefore, it is not allowed to mix the two gases in the plasma cleaning machine. In the vacuum plasma state, hydrogen plasma is bright red, similar to argon plasma, but slightly darker than argon plasma under the same discharge environment.
3. Nitrogen
The plasma formed by the ionization of nitrogen produces a bonding reaction with some molecules, so it is also an active gas, but compared to oxygen and hydrogen, its particles are heavier. In the application of a general plasma cleaning machine, this Class gas is generally defined as a kind of gas between the reactive gas oxygen, hydrogen and the rare gas argon. During cleaning and activation, a certain bombardment and etching effect should be achieved, and at the same time, air oxidation of a part of the metal surface can be avoided. Plasma formed by mixing nitrogen and other gases is generally used to process some special materials. In the vacuum chamber, nitrogen plasma will be brighter than argon and hydrogen plasma under the same discharge.
Plasma surface treatment
Oxygen plasma treatment is currently a commonly used dry etching method. Oxygen (sometimes mixed with argon) is used to treat aluminum, stainless steel, glass, plastic and ceramic surfaces.
Plasma activation
Better printing or bonding can be done by slightly changing the activated surface. The etching machine can allow plasma to attack the printed circuit board to improve its adhesive properties, such as adhesion and surface finish.
Plasma surface modification

The modification of plasma surface treatment equipment refers to the cleaning of products to improve their printing or adhesion capabilities. The purpose of plasma cleaning is to remove surface organic contaminants. Plasma treats the surface of your product and accepts adhesives or printing inks. Commonly used for plasma surface modification of polytetrafluoroethylene or plastics, it will actually change the surface of the material, leaving free radicals and sticking to the glue or ink.