Shenzhen CRF Co., Ltd.

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After the material is processed by the plasma activation machine, there are 4 changes to solve the surface adhesion prob

After the material is processed by the plasma activation machine, there are 4 changes to solve the surface adhesion problem:

The main functions of the plasma activation machine for processing materials are:
1. Surface etching
Under the action of plasma, some chemical bonds on the surface of the material are broken, forming small molecular products or being oxidized to CO and CO: etc., making the surface of the material uneven and increasing its roughness.
2. Surface activation, cleaning
Under the action of the plasma of the plasma activator, some active atoms, free radicals and unsaturated bonds appear on the surface of the hard-to-stick plastic. These active groups will react with the active particles in the plasma to generate new active groups. However, the material with active groups will be affected by the action of oxygen or the movement of molecular chain segments, so that the surface active groups disappear. Therefore, the surface activity of the plasma-treated material has a certain time effect.
3. Surface grafting
In the surface modification of materials by plasma, due to the effect of active particles on the surface molecules in the plasma, the surface molecular chains are broken to generate new free radicals, double bonds and other active groups, and then surface crosslinking, grafting, etc. reaction.
4. Surface polymerization
It will polymerize to produce a deposition layer on the surface of the material, and the existence of the deposition layer is beneficial to improve the bonding ability of the material surface. When low-temperature plasma is used to treat hard-to-stick plastics, the above four modes of action will appear at the same time.
When the surface finish of the material is required to be very high, it is necessary to use surface activation for coating, deposition, bonding, etc., when the surface finish of the material is not damaged, then plasma is used for activation. The infiltration effect of water droplets on the surface of the material after plasma activation is significantly stronger than other treatment methods. We used a plasma activation machine to do the cleaning test of the mobile phone screen, and found that the surface of the mobile phone screen after plasma treatment was completely wetted by water.
The current trends in assembly technology are mainly SIP, BGA, and CSP packages that enable semiconductor devices to develop in the direction of modularization, high integration, and miniaturization. In such packaging and assembly processes, the major problems are organic contamination at the bonding filler and oxide film formed during electric heating. Due to the presence of contaminants on the bonding surface, the bonding strength of these components is reduced and the potting strength of the resin after encapsulation is reduced, which directly affects the assembly level and continued development of these components. In order to improve and improve the assembly capabilities of these components, everyone is trying everything possible to deal with them. Improved practice has proved that the introduction of plasma activator plasma cleaning technology for surface treatment in the packaging process can greatly improve packaging reliability and increase yield.
During the COG process of mounting bare chip ICs on glass substrates (LCD), when the chips are hardened at a high temperature after bonding, there is an analysis of the substrate coating on the surface of the bonding filler. Sometimes there are overflowing components of the connecting agent such as Ag paste contaminate the bonding filler. If these contaminants can be cleaned and removed with a plasma activator before the hot-press bonding process, the quality of the hot-press bonding can be greatly improved. Furthermore, since the wettability of the substrate and the surface of the bare chip IC is improved, the adhesion of the LCD-COG module can also be improved, and at the same time, the problem of line corrosion can be reduced.

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