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Chengfeng Zhizhi surface plasma processing equipment for your wafer silicon photoresist removal examples:
The principle of the plasma stripping method of surface plasma treatment equipment is that the dry plasma stripping method is the main etching gas. The device uses high-frequency and high-pressure energy to ionize and generate oxygen ions and free oxygen atoms in a vacuum plasma degumming reaction chamber.
A plasma in which oxygen molecules and electrons are mixed, in which free oxygen atoms have a strong oxidizing ability (about 10-20%), and react with the wafer photoresist film under high-frequency voltage: O2→O*+O* ,CxHy+O*→CO2↑+H2O↑. The synthesized CO2 and H2O are pumped out immediately after the reaction. The advantages of plasma degumming of surface plasma treatment equipment are simple degumming operation, high degumming efficiency, clean and smooth surface, no scratches, low cost, and environmental protection.
Chengfeng Zhizhi surface plasma treatment equipment plasma degumming uses high-performance components and software, which can easily control process parameters. Its process monitoring and data acquisition software can achieve strict quality control. This technology has been successful. Suitable for power transistors, analog devices, sensors, optical devices, optoelectronic devices, electronic devices, MOEMS, biological devices, LEDs and other fields.
The above findings indicate that a large amount of photoresist remains on the surface of the silicon wafer before it is processed. After the surface plasma treatment equipment of Chengfeng Zhizhi surface plasma treatment equipment, the surface photoresist is completely removed, and the effect is very good.
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