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Plasma cleaning machine surface modification PCB board plasma cleaning machine:
The PCB board plasma cleaning machine can process at high speed online, improve production efficiency, and use the characteristics of plasma to clean, activate and activate the surface of solid materials to be treated, so as to achieve the purpose of changing the surface microstructure, chemical properties, and energy.
Plasma surface modification is the process of interaction between plasma and material surface, which includes two processes of plasma physics and plasma chemistry. The mechanism of plasma and material surface modification can be simply explained as follows: various active particles in the plasma collide with the material surface, triggering further reaction of macromolecular free radicals in the process of exchanging energy, introducing new gene groups on the material surface and removing small molecules. molecules, the process leads to an improvement in the surface properties of the material. Studies have shown that there are four main changes on the surface of the material after plasma action:
Generate free radicals. When the active particles in the discharge space hit the surface of the material, the intermolecular chemical bonds on the surface are opened, thereby generating macromolecular free radicals, and the surface of the material is reactive. Surface etching occurs. The surface of the material becomes rough and the shape of the surface changes. Surface crosslinking occurs. The free radicals on the surface of the material recombine to form a dense network cross-linked layer. Introduce polar gene groups. The free radicals on the surface are combined with the reactive particles of DBD discharge control to introduce polar genes with strong reactivity.
If a reactive gas is introduced into the discharge gas, complex chemical reactions will occur on the surface of the activated material, and new functional groups such as mel, amino, and carboxyl groups will be introduced. These functional groups are active groups, which can significantly improve the surface activity of the material. .
The large star ions, excited state molecules, free radicals and other active particles in the plasma act on the surface of the solid sample, which not only removes the original contaminants and impurities on the surface, but also causes etching to roughen the surface of the sample , forming many fine pits and increasing the specific surface of the sample. Improves wetting properties of solid surfaces.
Plasma Surface Modification, Plasma Surface Cleaning: Surface modification increases adhesion, which is beneficial to coating and printing. The surface of plastic toys is chemically inert, and it is difficult to bond and print with general-purpose adhesives without special surface treatment. The plasma cleaning machine mainly etches, activates, grafts, and polymerizes the surface.
The particle energy in the plasma is 0~20eV, and most of the bond energy in the polymer is 0~10eV. Therefore, after the plasma acts on the solid surface, the original chemical bonds on the solid surface can be broken. The free radicals form a network-like cross-linking structure with these bonds, which greatly activates the surface activity.
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