Shenzhen CRF Co., Ltd.

Support material testing and equipment testing

Focus on R & D and manufacturer of plasma cleaning machine for 20 years

Hot Line
13632675935

What kind of plasma cleaning should be used for dry cleaning of wafers in plasma cleaning equipment

What kind of plasma cleaning should be used for dry cleaning of wafers in plasma cleaning equipment:
Wafer cleaning is divided into wet cleaning and dry cleaning. Plasma cleaning belongs to dry cleaning. Contaminants on the wafer surface are invisible to the naked eye and require plasma cleaning to remove them. Which equipment should be used for dry cleaning of wafers? You deserve to own the vacuum plasma cleaning equipment made by Chengfeng Zhizhi.

The process of plasma cleaning equipment to clean wafers is as follows: first put the wafer into the vacuum reaction chamber of the equipment, and then evacuated. After reaching a certain degree of vacuum, the reaction gas is introduced. These reaction gases are ionized to form plasma and the wafer. The surface undergoes chemical and physical reactions to produce volatiles, and the surface of the wafer is cleaned to keep it in a hydrophilic state. What should be paid attention to when choosing plasma cleaning equipment for cleaning wafers?

Requirements for cavity and bracket:
Plasma cleaning of wafers is carried out in a clean room with a level of 1,000 or more. The requirements for wafers are very high. If there are any unqualified wafers on the wafers, it will cause irreparable defects. Therefore, the cavity of the plasma cleaning equipment must first be aluminum, not stainless steel; the sliding part of the support for the wafer should be made of materials that are not prone to dust and plasma corrosion; the electrode and the support are removed to facilitate daily maintenance.
The electrode spacing and number of layers, as well as the requirements for gas path distribution:
Parameters such as the electrode spacing, number of layers, and gas path distribution in the reaction chamber of the plasma cleaning equipment have an important impact on the uniformity of wafer processing. These indicators need to be continuously tested and optimized.
Requirement of electrode plate temperature:
During the plasma cleaning process, a certain amount of heat will be accumulated. When the process requires it, the electrode plates must be kept within a certain temperature range. Therefore, the electrodes after plasma cleaning are generally cooled by adding water.
Tips for placing:
The multi-layer plasma cleaning equipment has a high production capacity. It can place multiple wafers on each layer of the support as needed. It is more suitable for semiconductor discrete devices, power electronic components dedicated 4-inch, 6-inch wafers, etc. .
If you are interested in the equipment or want to know more details, please click Chengfeng Zhizao online customer service consultation, Chengfeng Zhizao is waiting for your call!

Related plasma products
Plasma news


线

CRF plasma——Focus on plasma 20 years