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Plasma PCB cleaning machine PCB faces greater challenges in materials and process technology

Plasma PCB cleaning machine PCB faces greater challenges in materials and process technology:
For the printed circuit board manufacturing industry, the arrival of 5G is an epoch-making change. The frequency is 5G, including low frequency frequencies below 6GHZ, and the industrial field includes millimeter wave frequencies above 6GHZ. Compared with low frequency, the propagation distance of millimeter wave itself is greatly reduced, and it is necessary to greatly increase the number of base stations to achieve large-scale coverage, which brings huge market opportunities to the PCB industry. The industry now predicts that the number of 5G base stations will reach twice that of the 4G era, and the number of high-frequency printed boards used in 5G base stations will be several times that of the 4G era. It can be seen that the PCB products used in the various hardware modules of the 5G communication system and their characteristics, the communication PCB will develop in the direction of large size, high density, high frequency, high speed, low loss, low frequency mixed pressure, rigid-flex combination, etc. Among these technologies, the operating frequency carried by the high-frequency micro-board has been significantly improved compared with the previous four generations of communication technologies, which poses new challenges to the materials and process technology used. This article focuses on the main materials of high-frequency PCB boards, such as copper foil. , Base material, glass fiber, etc., as well as the key plasma PCB cleaning machine process technology such as drawing accuracy control, high-frequency sheet resistance production technology, dense hole formation technology, hole metalization pretreatment technology, back drilling technology, mixed pressure technology, etc. The new requirements are introduced.

Reinforced PTFE and filled ceramic PTFE are not easy to wet in the high-frequency substrate. Before the orifice is metalized, the drilling dirt needs to be removed to bite the surface of the substrate. Commonly used potassium permanganate chemical degumming process for conventional FR-4 sheet material has low bite corrosion efficiency and cannot be completely removed from drilling dirt. Therefore, plasma pcb cleaning machine is generally used to remove high frequency PCB hole wall drilling dirt. , The principle is to clean and preheat the printed board with a nitrogen plasma on the logarithmic hole wall; then use a mixed gas such as oxygen and carbon tetrafluoride plasma to react with resin compounds, glass fiber cloth, etc. to remove biting; use oxygen plasma The pcb cleaning machine removes the dust on the hole wall. After the hole wall is decontaminated by plasma, the metallization treatment is carried out. , The wall quality has improved significantly.
In the 5G era, the demand for high-frequency printed boards is increasing. PCBs are facing greater challenges in materials and process technology. The choice of substrate materials, copper foil and glass fiber is moving in the direction of high frequency and low loss. The control requirements of the plasma pcb cleaning machine for the key process are more refined and strict. At the same time, the engineering experience is gradually accumulated in the continuous practice process, and the key parameters are precipitated to lay the foundation for the production of high-quality, high-frequency PCBs.

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