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Decryption of the basic technical principles in the semiconductor packaging field of vacuum surface plasma treatment equ

Decryption of the basic technical principles in the semiconductor packaging field of vacuum surface plasma treatment equipment:
During the wafer manufacturing process, affected by the material, process and environment, various impurities invisible to the naked eye will appear on the surface of the wafer, such as various particles, organic matter, oxide and residual abrasive particles, etc., without damaging the wafer and other materials. Under the premise of its own characteristics, removing harmful impurities on the surface of the wafer is of great significance to the function, reliability, and integration of the wafer. Therefore, it is more suitable to use surface plasma processing equipment. Let's discuss the working principle of vacuum surface plasma processing equipment in the field of semiconductor packaging.
In the field of semiconductor packaging, vacuum surface plasma processing equipment is usually used. As the equipment is continuously evacuated, the degree of vacuum in the vacuum chamber continues to increase, the distance between molecules becomes larger, and the intermolecular force becomes smaller. The use of vacuum surface plasma processing equipment The high-voltage AC electric field generated by the plasma generator excites process gases such as Ar, H2, N2, O2, CF4, making it a highly reactive or high-energy plasma, which reacts with organic pollutants and particles on the surface of semiconductor devices to produce volatilization Sexual substances are pumped out by a vacuum pump to achieve purification, activation, etching and other purposes.

plasma treatment equipment

The vacuum surface plasma treatment equipment belongs to nano-level treatment and will not change the inherent properties of the material. After plasma treatment, a certain degree of roughness or hydrophilic functional groups will be formed on the surface of the material, which improves the reliability of welding and increases the bonding force between materials. Thereby improving the credibility, stability and service life of the product.
Chengfeng Zhizao focuses on the research and development and manufacturing of plasma technology. If you want to have a more detailed understanding of the equipment or have questions about the use of the equipment, please click on the online customer service of Chengfeng Zhizao. Chengfeng Zhizao is waiting for your call!

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